Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array
نویسندگان
چکیده
This paper presents a novel strategy for transient liquid phase bonding (TLPB) in three-dimensional integrated circuit (3D IC) integration that utilizes preformed Cu-Sn nanocomposite interlayer based on patterned copper nanowire array. unique significantly accelerates the process by ?10 times compared with traditional TLPB using monolithic Sn layer, thanks to Cu array grown through template-assisted electrodeposition. It only takes ? 2 min achieve intermetallic joints refined microstructures at 250 °C interlayers.
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ژورنال
عنوان ژورنال: Materials Letters
سال: 2022
ISSN: ['1873-4979', '0167-577X']
DOI: https://doi.org/10.1016/j.matlet.2021.131074